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CZRB5342B-HF - Comchip Technology

Description: Zener Diodes ZENER 5W 6.8V SMB HALOGEN-FREE

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CZRB5342B-HF - Comchip Technology - PCB symbol
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PCB Footprints
CZRB5342B-HF - Comchip Technology PCB footprint - Diodes Moulded - Diodes Moulded - SMB/DO-214AA
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3D Models
CZRB5342B-HF - Comchip Technology - 3D model - Diodes Moulded - SMB/DO-214AA
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CZRB5342B-HF Details

  • Manufacturer Part Number:

    CZRB5342B-HF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SMB, 2 PIN

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    5.95

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • JEDEC-95 Code:

    DO-214AA

  • JESD-30 Code:

    R-PDSO-C2

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    5 W

  • Reference Voltage-Nom:

    6.8 V

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    175 mA

CZRB5342B-HF Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package, and a minimum of 2oz copper thickness is suggested for the PCB. A 4-layer PCB with a dedicated ground plane is also recommended to reduce thermal resistance.
  • Ensure that the device is operated within the recommended voltage range, and that the PCB is designed to minimize thermal gradients. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and heat sink.
  • The recommended soldering conditions are: peak temperature 260°C, time above 217°C 60s, and time above 183°C 150s. A nitrogen atmosphere is recommended to reduce oxidation.
  • Store the devices in their original packaging, away from direct sunlight and moisture. Avoid bending or flexing the leads, and handle the devices by the body, not the leads. Use anti-static packaging and follow ESD precautions during handling.
  • The device has undergone various reliability tests, including High Temperature Operating Life (HTOL), Temperature Cycle, and Electrostatic Discharge (ESD) testing, as per the JEDEC standards.

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CZRB5342B-HF Overview

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