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D12390F20V - Renesas Electronics

Description: The H8S/2398, 2357 Group is supported only for customers who have already adopted these products. The RX651 Group is recommended for new designs.

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D12390F20V - Renesas Electronics - PCB symbol
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PCB Footprints
D12390F20V - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - FP-128B
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3D Models
D12390F20V - Renesas Electronics - 3D model - Quad Flat Packages - FP-128B
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D12390F20V Details

  • Manufacturer Part Number:

    D12390F20V

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    FQFP

  • Package Description:

    FQFP-128

  • Pin Count:

    128

  • Manufacturer Package Code:

    PRQP0128KB

  • HTS Code:

    8542.31.00.20

  • Factory Lead Time:

    4 Weeks

  • Date Of Intro:

    2018-06-18

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    16

  • DAC Channels:

    YES

  • DMA Channels:

    NO

  • JESD-30 Code:

    R-PQFP-G128

  • JESD-609 Code:

    e6

  • Length:

    20 mm

  • Number of Terminals:

    128

  • Operating Temperature-Max:

    75 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    NO

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLATPACK, FINE PITCH

  • RAM (bytes):

    4096

  • Seated Height-Max:

    3.15 mm

  • Speed:

    20 MHz

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    TIN BISMUTH

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

D12390F20V Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the package.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.
  • The power-on sequence should follow the recommended timing diagram in the datasheet. Ensure a minimum 10 ms delay between VCC and VDD power-up, and a 100 ms delay between VDD and clock signal application.
  • Use a multimeter to measure voltage levels at the output pins. Check for proper decoupling, and ensure that the input voltage is within the recommended range. Consult the datasheet for specific troubleshooting guidelines.
  • Implement ESD protection diodes at the input pins, and ensure that the PCB design includes a solid ground plane and a Faraday cage structure. Handle the device with an anti-static wrist strap and follow proper ESD handling procedures.

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D12390F20V Overview

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