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D3SB60 - EIC Semiconductor

Description: Rectifier Bridge Diode Single 600V 4A 4-Pin RBV4

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PCB Footprints
D3SB60 - EIC Semiconductor PCB footprint - Other - Other - D3SB60-5
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D3SB60 - EIC Semiconductor  - 3D model - Other - D3SB60-5
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D3SB60 Details

  • Manufacturer Part Number:

    D3SB60

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    EIC Semiconductor Inc

  • YTEOL:

    6.85

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.05 V

  • JESD-30 Code:

    R-PSFM-T4

  • Non-rep Pk Forward Current-Max:

    120 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    4 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    TS 16949

  • Rep Pk Reverse Voltage-Max:

    600 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

D3SB60 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the D3SB60 is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device can tolerate a wider temperature range during storage, from -55°C to 150°C.
  • To ensure proper biasing, follow the recommended voltage and current settings outlined in the datasheet. Typically, this involves applying a voltage supply of 3.3V or 5V, depending on the specific application, and ensuring the current limit is set to prevent overheating.
  • When designing a PCB with the D3SB60, it's crucial to follow good layout practices, such as keeping the device away from high-current paths, using a solid ground plane, and minimizing trace lengths to reduce parasitic inductance and capacitance.
  • To troubleshoot issues with the D3SB60, start by verifying the power supply voltage and current, checking for any signs of physical damage or overheating, and reviewing the PCB layout for potential design flaws. Consult the datasheet and application notes for guidance on specific troubleshooting procedures.
  • Yes, the D3SB60 is a sensitive device and requires proper ESD protection during handling and assembly. Use anti-static wrist straps, mats, and packaging materials to prevent damage from electrostatic discharge.

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D3SB60 Overview

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