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DAN202UT106 - ROHM Semiconductor

Description: ROHM DAN202UT106 Dual SMT Switching Diode, Common Cathode, 80V 300mA, 4ns, 3-Pin SOT-323

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DAN202UT106 - ROHM Semiconductor PCB footprint - Other - Other - UMD3 (SC-70)
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DAN202UT106 - ROHM Semiconductor  - 3D model - Other - UMD3 (SC-70)
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DAN202UT106 Details

  • Manufacturer Part Number:

    DAN202UT106

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Part Package Code:

    SC-70

  • Package Description:

    SC-70, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    COMMON CATHODE, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.15 W

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    80 V

  • Reverse Current-Max:

    0.1 µA

  • Reverse Recovery Time-Max:

    0.004 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

DAN202UT106 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are suggested. Refer to ROHM's application note for detailed guidelines.
  • Monitor the input voltage, output current, and ambient temperature to ensure they are within the specified ranges. Implement overvoltage protection, undervoltage lockout, and thermal monitoring to prevent damage.
  • Use a shielded layout, decouple the input and output with capacitors, and add a common-mode choke to minimize EMI. Ensure the PCB layout and component selection comply with relevant EMC standards.
  • Yes, the DAN202UT106 is AEC-Q100 qualified and suitable for automotive and high-reliability applications. However, ensure you follow the recommended operating conditions, and consult ROHM's reliability report for detailed information.
  • Use a thermal imaging camera to identify hotspots, and check the input voltage, output current, and ambient temperature. Verify the PCB layout and component selection meet the recommended guidelines. Consult ROHM's application notes and technical support for further assistance.

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DAN202UT106 Overview

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