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DAN217UMTL - ROHM Semiconductor

Description: High-speed switching, 80V, 100mA, Series Connection, Switching Diode

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DAN217UMTL - ROHM Semiconductor PCB footprint - Other - Other - DAN217UMTL-1
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DAN217UMTL - ROHM Semiconductor  - 3D model - Other - DAN217UMTL-1
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DAN217UMTL Details

  • Manufacturer Part Number:

    DAN217UMTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-85, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.70

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.1

  • Additional Feature:

    HIGH RELIABILITY

  • Application:

    GENERAL PURPOSE

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.2 V

  • JESD-30 Code:

    R-PDSO-F3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    4 A

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.2 W

  • Rep Pk Reverse Voltage-Max:

    80 V

  • Reverse Recovery Time-Max:

    0.004 µs

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

DAN217UMTL Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the DAN217UMTL is -40°C to 125°C.
  • To ensure proper soldering, follow the recommended reflow soldering profile and use a solder paste with a melting point between 217°C to 220°C. Also, ensure the PCB is designed with a suitable land pattern and thermal relief.
  • The maximum power dissipation for the DAN217UMTL is 1.5W. However, this value may vary depending on the operating conditions and PCB design. It's essential to perform thermal analysis and design the PCB accordingly to ensure safe operation.
  • While the DAN217UMTL is designed to operate in a wide range of temperatures, it's not recommended for use in high-humidity environments (>80% RH) without proper protection. Consider using a moisture-resistant coating or conformal coating to protect the device.
  • To prevent damage, store the DAN217UMTL in its original packaging or an equivalent ESD-protective package. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures during storage and shipping.

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DAN217UMTL Overview

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