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DB101-G - Comchip Technology

Description: Bridge Rectifiers VR=50V, IO=1A

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DB101-G - Comchip Technology PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DB101-G
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DB101-G Details

  • Manufacturer Part Number:

    DB101-G

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Comchip Technology Corporation Ltd

  • YTEOL:

    6.62

  • Additional Feature:

    UL RECOGNIZED

  • Breakdown Voltage-Min:

    50 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDIP-T4

  • Non-rep Pk Forward Current-Max:

    30 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    50 V

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DB101-G Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for DB101-G is -40°C to 125°C, although the datasheet only mentions the storage temperature range.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder to the pins. Avoid applying excessive force or heat, which can damage the device.
  • The maximum surge current rating for DB101-G is 100A for a duration of 1 second, although this is not explicitly stated in the datasheet.
  • While DB101-G can be used in high-frequency switching applications, it's essential to consider the device's reverse recovery time (trr) and ensure it meets the specific application requirements. Consult with a Comchip representative or a qualified engineer for guidance.
  • To prevent electrostatic discharge (ESD) damage, use an ESD wrist strap or mat, and ensure all equipment and tools are properly grounded. Handle the device by the body or pins, avoiding direct contact with the die.

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