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DB3S308F0L - Panasonic

Description: DB3S308F0L, Schottky Diode, Switching 0.1A max, 30V 1.3ns Cathode-Anode, Dual, 3-Pin, SSMini3 F3 B

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PCB Footprints
DB3S308F0L - Panasonic PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SSMini3-F2-B
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3D Models
DB3S308F0L - Panasonic  - 3D model - SO Transistor Flat Lead - SSMini3-F2-B
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DB3S308F0L Details

  • Manufacturer Part Number:

    DB3S308F0L

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    SC-89, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Manufacturer:

    Panasonic Electronic Components

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Forward Voltage-Max (VF):

    0.29 V

  • Frequency Band:

    VERY HIGH FREQUENCY

  • JESD-30 Code:

    R-PDSO-F3

  • Non-rep Pk Forward Current-Max:

    1 A

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    0.1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

DB3S308F0L Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DB3S308F0L is a rectangular pad with dimensions of 3.3mm x 2.5mm, with a 0.5mm radius corner and a 0.3mm spacing between pads.
  • To ensure reliable soldering, use a soldering iron with a temperature of 250°C to 270°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the risk of overheating or cold solder joints.
  • The maximum operating temperature range for the DB3S308F0L is -40°C to 125°C, with a storage temperature range of -40°C to 150°C.
  • Handle the DB3S308F0L by the edges or the body, avoiding touching the pins or the electrical contacts. Use an anti-static wrist strap or mat to prevent electrostatic discharge damage.
  • The recommended reflow soldering profile for the DB3S308F0L is a peak temperature of 240°C to 250°C, with a dwell time of 30 seconds to 60 seconds above 217°C.

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DB3S308F0L Overview

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