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DEI1188-SMS - Device Engineering Incorporated

Description: DEI1188 8CH GND/OPEN DISCRETE INTERFACE IC W/ EXT HV PROTECTION

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DEI1188-SMS - Device Engineering Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - DEI1188-SMS
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DEI1188-SMS - Device Engineering Incorporated  - 3D model - Small Outline Packages - DEI1188-SMS
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DEI1188-SMS Details

  • Manufacturer Part Number:

    DEI1188-SMS

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    16

  • Country Of Origin:

    USA

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Device Engineering Incorporated

  • YTEOL:

    8.5

  • Additional Feature:

    IT ALSO NEED ANALOG SUPPLY VOLTAGE FROM 12 TO 16.5 V

  • Interface IC Type:

    INTERFACE CIRCUIT

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e0

  • Length:

    9.9 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    3.465 V

  • Supply Voltage-Min:

    3.135 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    MOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Width:

    3.91 mm

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