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DF02S - onsemi

Description: Low leakage.; Surge overload rating: 50 amperes peak.; Glass passivated junction.; Lead Free Compliant to EU RoHS 2002/95/EU Directives; Green Molding Compound: IEC61249; Qualified with IR Reflow and Wave Soldering; UL Certified, UL # E258596

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PCB Footprints
DF02S - onsemi PCB footprint - Other - Other - SOT508P985X260-4N
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DF02S - onsemi  - 3D model - Other - SOT508P985X260-4N
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DF02S Details

  • Manufacturer Part Number:

    DF02S

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    PDIP-4 GW

  • Manufacturer Package Code:

    709AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    7.35

  • Breakdown Voltage-Min:

    200 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    50 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1.5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    3.1 W

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    UL RECOGNIZED

  • Rep Pk Reverse Voltage-Max:

    200 V

  • Reverse Current-Max:

    5 µA

  • Reverse Test Voltage:

    200 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

DF02S Frequently Asked Questions (FAQs)

  • A good PCB layout for the DF02S involves keeping the input and output traces separate, using a solid ground plane, and placing the input and output capacitors close to the device. Additionally, it's recommended to use a shielded inductor and to keep the switching node (SW) away from sensitive nodes.
  • To ensure the DF02S operates within the recommended junction temperature range, it's essential to provide adequate heat sinking, such as using a thermal pad or a heat sink, and to keep the device away from other heat sources. Additionally, reducing the ambient temperature and using a lower input voltage can also help reduce the junction temperature.
  • The recommended input capacitor type for the DF02S is a low-ESR ceramic capacitor, such as an X5R or X7R dielectric capacitor. The recommended value is 10uF to 22uF, depending on the input voltage and output current requirements.
  • The output voltage ripple for the DF02S can be calculated using the following formula: ΔVout = (Iout * ESL) / (Cout * fsw), where ESL is the equivalent series inductance of the output capacitor, Cout is the output capacitance, and fsw is the switching frequency.
  • The recommended output capacitor type for the DF02S is a low-ESR ceramic capacitor, such as an X5R or X7R dielectric capacitor. The recommended value depends on the output voltage and current requirements, but a typical value is 10uF to 22uF.

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