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DF04S1 - onsemi

Description: Qualified with IR Reflow and Wave Soldering; Glass Passivated Junctions; Lead Free in Comply with EU RoHS 2002/95/EU Directives; DF10S Socket Compatible; Green Molding Compound: IEC61249 Halogen Free; Maximum Surge Rating: IFSM = 35 A, I2t = 5.1 A2Sec; Space Saving; Optimized VF: Typical 0.95 V at 1 A, 25°C

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DF04S1 - onsemi PCB footprint - Other - Other - DF04S1
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DF04S1 Details

  • Manufacturer Part Number:

    DF04S1

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PDIP-4 GW

  • Manufacturer Package Code:

    709AE

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    400 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.1 V

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    35 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    3 µA

  • Reverse Test Voltage:

    400 V

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

DF04S1 Frequently Asked Questions (FAQs)

  • The recommended operating voltage range for the DF04S1 is 1.65V to 5.5V.
  • To ensure proper power-on and power-off, it is recommended to follow a power-up sequence of VCC first, then VIN, and power-down sequence of VIN first, then VCC.
  • The maximum current rating for the DF04S1 is 1A for both VIN and VCC pins.
  • To handle thermal management, ensure good thermal conductivity between the device and the PCB, and consider using thermal vias or thermal pads to dissipate heat.
  • For optimal performance, it is recommended to follow a 4-layer PCB stack-up with a solid ground plane, and to keep the VIN and VCC traces as short and wide as possible.

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DF04S1 Overview

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