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DF2215RUTE24V - Renesas Electronics

Description: The H8S/2215 Group is supported only for customers who have already adopted these products. The RX651 Group is recommended for new designs.

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PCB Footprints
DF2215RUTE24V - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PTQP0120LA-A
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DF2215RUTE24V - Renesas Electronics  - 3D model - Quad Flat Packages - PTQP0120LA-A
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DF2215RUTE24V Details

  • Manufacturer Part Number:

    DF2215RUTE24V

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TFQFP

  • Package Description:

    14 X 14 MM, 1.20 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, PLASTIC, TFQFP-120

  • Pin Count:

    120

  • Manufacturer Package Code:

    PTQP0120LA

  • HTS Code:

    8542.31.00.20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT MIN 13MHZ

  • Address Bus Width:

    24

  • Bit Size:

    16

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    YES

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G120

  • Length:

    14 mm

  • Number of I/O Lines:

    75

  • Number of Terminals:

    120

  • Operating Temperature-Max:

    75 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    24 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    2.7 V

  • Supply Voltage-Nom:

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

DF2215RUTE24V Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated thermal layer and a solid ground plane is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • The power-up sequence should follow the recommended timing diagram in the datasheet. Ensure a minimum 10 ms delay between VCC and VDD power-up, and a 100 ms delay between VDD and EN pin assertion.
  • Use the device's power-saving modes, such as the low-power standby mode. Optimize the system's clock frequency and voltage supply to minimize power consumption.
  • Implement ESD protection diodes on all input and output pins. Use a TVS (Transient Voltage Suppressor) diode on the power supply lines and ensure a minimum of 1 kΩ series resistance on all input pins.

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DF2215RUTE24V Overview

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