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DF2218UTF24V - Renesas Electronics

Description: The H8S/2218, 2212 Group is supported only for customers who have already adopted these products. The RX231, RX651 Groups are recommended for new designs.

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PCB Footprints
DF2218UTF24V - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PTQP0100LC-A
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DF2218UTF24V - Renesas Electronics  - 3D model - Quad Flat Packages - PTQP0100LC-A
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DF2218UTF24V Details

  • Manufacturer Part Number:

    DF2218UTF24V

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TFQFP

  • Package Description:

    12 X 12 MM, 1.20 MM HEIGHT, 0.40 MM PITCH, ROHS COMPLIANT, PLASTIC, TQFP-100

  • Pin Count:

    100

  • Manufacturer Package Code:

    PTQP0100LC

  • Country Of Origin:

    Japan

  • HTS Code:

    8542.31.00.20

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Additional Feature:

    ALSO OPERATES AT 2.4V MINIMUM SUPPLY

  • Address Bus Width:

    24

  • Bit Size:

    16

  • Clock Frequency-Max:

    24 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • External Data Bus Width:

    16

  • JESD-30 Code:

    S-PQFP-G100

  • Length:

    12 mm

  • Number of I/O Lines:

    69

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    75 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.2 mm

  • Speed:

    24 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    12 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

DF2218UTF24V Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
  • Implement a heat sink or thermal pad on the top of the IC, and ensure good airflow. Consider using a thermal interface material (TIM) for improved heat transfer.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended, placed as close to the VIN pin as possible.
  • Use a high-precision external resistor divider network, and consider adding a 10nF to 100nF capacitor in parallel with the output voltage feedback resistor.
  • The maximum allowed voltage on the EN pin is 6V. Ensure the EN pin is driven high after the input voltage (VIN) has reached a minimum of 2.5V, and the output voltage (VOUT) has stabilized.

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