I2C(2) CAN ALSO BE INCLUDED AS AN OPTIONAL INTERFACE
Address Bus Width:
24
Bit Size:
16
Boundary Scan:
NO
CPU Family:
H8S/2000
Clock Frequency-Max:
25 MHz
DAC Channels:
YES
DMA Channels:
YES
External Data Bus Width:
16
Format:
FIXED POINT
Integrated Cache:
NO
JESD-30 Code:
S-PQFP-G120
Length:
14 mm
Low Power Mode:
YES
Moisture Sensitivity Level:
3
Number of DMA Channels:
4
Number of External Interrupts:
8
Number of I/O Lines:
94
Number of Serial I/Os:
5
Number of Terminals:
120
Number of Timers:
2
On Chip Data RAM Width:
8
On Chip Program ROM Width:
8
Operating Temperature-Max:
75 °C
Operating Temperature-Min:
-20 °C
PWM Channels:
YES
Package Body Material:
PLASTIC/EPOXY
Package Code:
TFQFP
Package Equivalence Code:
TQFP120,.63SQ,16
Package Shape:
SQUARE
Package Style:
FLATPACK, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel):
260
RAM (bytes):
32768
ROM (words):
524288
ROM Programmability:
FLASH
Seated Height-Max:
1.2 mm
Speed:
34 MHz
Supply Current-Max:
115 mA
Supply Voltage-Max:
3.6 V
Supply Voltage-Min:
3.3 V
Supply Voltage-Nom:
3.3 V
Surface Mount:
YES
Technology:
CMOS
Temperature Grade:
COMMERCIAL EXTENDED
Terminal Form:
GULL WING
Terminal Pitch:
0.4 mm
Terminal Position:
QUAD
Width:
14 mm
uPs/uCs/Peripheral ICs Type:
MICROCONTROLLER
DF2368VTE34V Frequently Asked Questions (FAQs)
A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
The critical timing parameters include the clock frequency, clock duty cycle, and setup/hold times for the input signals. Refer to the datasheet for specific values.
Follow the recommended power-up and power-down sequences in the datasheet. Ensure a slow voltage ramp-up (typically 1-2 ms) and a controlled voltage ramp-down to prevent latch-up.
Use 0.1 μF to 1 μF decoupling capacitors with a voltage rating of 2.5 V or higher. Place them as close as possible to the IC's power pins, with a maximum distance of 1 cm.
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DF2368VTE34V Overview
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