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DF36049GHV - Renesas Electronics

Description: The H8/36049 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.

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PCB Footprints
DF36049GHV - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - FP-80A_2021
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3D Models
DF36049GHV - Renesas Electronics  - 3D model - Quad Flat Packages - FP-80A_2021
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DF36049GHV Details

  • Manufacturer Part Number:

    DF36049GHV

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Pin Count:

    80

  • Manufacturer Package Code:

    PRQP0080JB

  • HTS Code:

    8542.31.00.20

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    16

  • CPU Family:

    H8/300H

  • Clock Frequency-Max:

    20 MHz

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G80

  • Length:

    14 mm

  • Number of I/O Lines:

    67

  • Number of Terminals:

    80

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP80,.68SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    4096

  • ROM (words):

    98304

  • ROM Programmability:

    FLASH

  • Speed:

    20 MHz

  • Supply Current-Max:

    36 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

DF36049GHV Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the package.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.
  • Use controlled impedance traces, minimize signal routing near noise sources, and implement signal termination and filtering as needed. Ensure signal integrity analysis and simulation during design.
  • Implement power gating, dynamic voltage and frequency scaling, and clock gating. Optimize software to minimize CPU utilization and use low-power modes when possible.
  • Use 0.1 μF to 1 μF decoupling capacitors with a voltage rating of 1.8 V or higher. Place them as close as possible to the power pins, with a maximum distance of 1 cm.

Trust Checks

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DF36049GHV Overview

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