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DF36049HV - Renesas Electronics

Description: The H8/36049 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.

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PCB Footprints
DF36049HV - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - FP-80A_2021
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DF36049HV - Renesas Electronics  - 3D model - Quad Flat Packages - FP-80A_2021
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DF36049HV Details

  • Manufacturer Part Number:

    DF36049HV

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    QFP

  • Pin Count:

    80

  • Manufacturer Package Code:

    PRQP0080JB

  • HTS Code:

    8542.31.00.20

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    16

  • CPU Family:

    H8/300H

  • Clock Frequency-Max:

    20 MHz

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G80

  • Length:

    14 mm

  • Number of I/O Lines:

    67

  • Number of Terminals:

    80

  • Operating Temperature-Max:

    70 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP80,.68SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Qualification Status:

    Not Qualified

  • RAM (bytes):

    4096

  • ROM (words):

    98304

  • ROM Programmability:

    FLASH

  • Speed:

    20 MHz

  • Supply Current-Max:

    36 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

DF36049HV Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the IC.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • The critical timing parameters include the clock frequency, setup and hold times, and signal rise and fall times. Refer to the datasheet for specific values and ensure your design meets these requirements.
  • Follow the recommended power-up and power-down sequences in the datasheet. Ensure a slow and controlled voltage ramp-up (typically 1-2 ms) and ramp-down (typically 1-5 ms) to prevent damage or malfunction.
  • Use 0.1 μF to 1 μF decoupling capacitors with a voltage rating of 10-25 V, placed as close as possible to the IC's power pins. Ensure the capacitors are rated for high-frequency operation.

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DF36049HV Overview

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