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DF36079GFZV - Renesas Electronics

Description: The H8/36077, H8/36079 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.

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DF36079GFZV - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - PLQ0064KB_A
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3D Models
DF36079GFZV - Renesas Electronics  - 3D model - Quad Flat Packages - PLQ0064KB_A
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DF36079GFZV Details

  • Manufacturer Part Number:

    DF36079GFZV

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LQFP

  • Package Description:

    10 X 10 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, LFQFP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    PLQP0064KB

  • HTS Code:

    8542.31.00.20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    16

  • Clock Frequency-Max:

    20 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    YES

  • JESD-30 Code:

    S-PQFP-G64

  • Length:

    10 mm

  • Number of I/O Lines:

    55

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    75 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    20 MHz

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

DF36079GFZV Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the package.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
  • Use controlled impedance traces, minimize signal routing near noise sources, and implement signal termination and filtering as needed. Ensure signal integrity analysis and simulation during design.
  • Implement dynamic voltage and frequency scaling, use power gating, and optimize clock frequencies. Consider using low-power modes and reducing switching activity.
  • Use 0.1 μF to 1 μF decoupling capacitors, placed as close as possible to the power pins. Ensure a low-ESR capacitor with a high-frequency response.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
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System Verified
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Community Approved
Sponsored

DF36079GFZV Overview

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