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DF36087FPV - Renesas Electronics

Description: The H8/36087 Group is supported only for customers who have already adopted these products. The RL78/G14 Group is recommended for new designs.

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DF36087FPV - Renesas Electronics PCB footprint - Quad Flat Packages - Quad Flat Packages - FP-64E
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DF36087FPV - Renesas Electronics  - 3D model - Quad Flat Packages - FP-64E
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DF36087FPV Details

  • Manufacturer Part Number:

    DF36087FPV

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LQFP

  • Package Description:

    10 X 10 MM, 1.70 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, LFQFP-64

  • Pin Count:

    64

  • Manufacturer Package Code:

    PLQP0064KC

  • HTS Code:

    8542.31.00.20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Has ADC:

    YES

  • Bit Size:

    16

  • Clock Frequency-Max:

    18 MHz

  • DAC Channels:

    NO

  • DMA Channels:

    NO

  • JESD-30 Code:

    S-PQFP-G64

  • Length:

    10 mm

  • Number of I/O Lines:

    45

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    75 °C

  • Operating Temperature-Min:

    -20 °C

  • PWM Channels:

    YES

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • ROM Programmability:

    FLASH

  • Seated Height-Max:

    1.7 mm

  • Speed:

    18 MHz

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    10 mm

  • uPs/uCs/Peripheral ICs Type:

    MICROCONTROLLER

DF36087FPV Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1mm clearance around the package for airflow and heat dissipation.
  • Use a low-ESR capacitor (e.g., 10uF, 100nF) close to the power pins. Ensure a stable 1.2V supply with minimal ripple (<10mV) and a high-quality LDO regulator.
  • Use a 24MHz external clock source with a 1.8V amplitude. Ensure the clock signal is clean and has minimal jitter (<100ps) for optimal performance.
  • Use a 10kΩ pull-up resistor and a 100nF capacitor to the reset pin. Ensure the reset signal is clean and has a minimum pulse width of 10ms.
  • Use a JTAG interface (e.g., Renesas E1 or E2 emulator) for debugging and testing. Ensure the target board is properly configured and the emulator is set up correctly.

Trust Checks

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DF36087FPV Overview

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