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DFBR030U3LP-13 - Diodes Incorporated

Description: BRIDGE RECT 1P 30V 3A DFN4040-8

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PCB Footprints
DFBR030U3LP-13 - Diodes Incorporated PCB footprint - Other - Other - U-DFN4040-8
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DFBR030U3LP-13 - Diodes Incorporated  - 3D model - Other - U-DFN4040-8
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DFBR030U3LP-13 Details

  • Manufacturer Part Number:

    DFBR030U3LP-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    U-DFN4040-8 , 8 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    0

  • Breakdown Voltage-Min:

    30 V

  • Configuration:

    BRIDGE, 4 ELEMENTS

  • Diode Element Material:

    SILICON

  • Diode Type:

    BRIDGE RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.42 V

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    20 A

  • Number of Elements:

    4

  • Number of Phases:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    1 W

  • Reference Standard:

    IEC-61000-4-2

  • Rep Pk Reverse Voltage-Max:

    30 V

  • Reverse Current-Max:

    400 µA

  • Reverse Test Voltage:

    30 V

  • Surface Mount:

    YES

  • Terminal Finish:

    NICKEL PALLADIUM GOLD

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

DFBR030U3LP-13 Frequently Asked Questions (FAQs)

  • Diodes Incorporated provides a recommended PCB layout and land pattern in their application notes or design guides. It's essential to follow these guidelines to ensure optimal performance, minimize thermal resistance, and reduce electromagnetic interference (EMI).
  • The DFBR030U3LP-13 has a high power density, so thermal management is crucial. Ensure good airflow, use a heat sink if necessary, and follow the recommended PCB layout to minimize thermal resistance. The device's thermal resistance (RθJA) is specified in the datasheet.
  • The DFBR030U3LP-13 is sensitive to electrostatic discharge (ESD). Handle the device with ESD-protective equipment, follow proper handling procedures, and ensure that the device is stored in an ESD-protected environment. The datasheet may provide specific ESD protection ratings and handling guidelines.
  • The DFBR030U3LP-13 may not be suitable for high-reliability or automotive applications without additional qualification and testing. Check with Diodes Incorporated for specific product variants or alternatives that meet the required standards, such as AEC-Q101 or ISO 26262.
  • Common failure modes for the DFBR030U3LP-13 include overheating, overvoltage, and overcurrent. Mitigate these risks by following the recommended operating conditions, using proper thermal management, and implementing overvoltage and overcurrent protection circuits.

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DFBR030U3LP-13 Overview

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