DFE201612E-R33M=P2 - Murata Electronics

DFE201612E-R33M=P2 Frequently Asked Questions (FAQs)

• What is the recommended land pattern for the DFE201612E-R33M=P2?
  Murata recommends a land pattern with a pad size of 2.5mm x 1.25mm, with a non-solder mask defined (NSMD) pad shape, and a minimum clearance of 0.2mm between the pad and the solder mask.
• Can I use the DFE201612E-R33M=P2 in a high-temperature environment?
  The DFE201612E-R33M=P2 is rated for operation up to 125°C, but it's recommended to derate the component's power handling according to the temperature derating curve provided in the datasheet. Additionally, ensure that the PCB and surrounding components can withstand the high temperature.
• How do I handle the DFE201612E-R33M=P2 during reflow soldering?
  Follow the recommended reflow soldering profile provided in the datasheet, with a peak temperature of 260°C and a time above 220°C of 30 seconds. Ensure that the component is properly aligned and secured during the reflow process.
• What is the recommended storage condition for the DFE201612E-R33M=P2?
  Store the components in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -20°C to 40°C, with a relative humidity of 60% or less.
• Can I use the DFE201612E-R33M=P2 in a humid or moist environment?
  The DFE201612E-R33M=P2 is not designed for use in humid or moist environments. If exposure to moisture is unavoidable, ensure that the component is properly sealed or coated to prevent moisture ingress.