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DFLZ8V2-TP - MCC

Description: • Ideally Suited for Automatic Assembly • Standard VZ Tolerance is +/- 5% • Halogen Free. “Green” Device (Note 1) • Moisture Sensitivity Level 1 • Epoxy Meets UL 94 V-0 Flammability Rating • Lead Free Finish/RoHS Compliant t (Note 2)("P" Suffix Designates Compliant. See Ordering Information)

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DFLZ8V2-TP - MCC - PCB symbol
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PCB Footprints
DFLZ8V2-TP - MCC PCB footprint - Small Outline Diode Flat Lead - Small Outline Diode Flat Lead - SOD-123FL-1
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3D Models
DFLZ8V2-TP - MCC - 3D model - Small Outline Diode Flat Lead - SOD-123FL-1
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DFLZ8V2-TP Details

  • Manufacturer Part Number:

    DFLZ8V2-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.50

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    ZENER DIODE

  • Dynamic Impedance-Max:

    2 Ω

  • JESD-30 Code:

    R-PDSO-F2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity:

    UNIDIRECTIONAL

  • Power Dissipation-Max:

    1 W

  • Qualification Status:

    Not Qualified

  • Reference Voltage-Nom:

    8.2 V

  • Reverse Current-Max:

    5 µA

  • Surface Mount:

    YES

  • Technology:

    ZENER

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Voltage Tol-Max:

    5%

  • Working Test Current:

    100 mA

DFLZ8V2-TP Frequently Asked Questions (FAQs)

  • The recommended land pattern for the DFLZ8V2-TP can be found in the Micro Commercial Components' application note AN-113, which provides detailed guidelines for PCB layout and land pattern design.
  • The DFLZ8V2-TP has a thermal pad on the bottom, which should be connected to a thermal plane on the PCB to dissipate heat. A thermal via array or a copper pour with multiple vias can be used to improve heat dissipation.
  • The DFLZ8V2-TP has an operating temperature range of -40°C to 125°C, but it's recommended to derate the voltage and current ratings at higher temperatures to ensure reliable operation.
  • Yes, the DFLZ8V2-TP is AEC-Q101 qualified, which means it meets the stringent requirements for automotive and high-reliability applications. However, it's essential to review the qualification report and ensure that the device meets the specific requirements of your application.
  • The DFLZ8V2-TP has a lead-free finish, and it's recommended to use a soldering profile with a peak temperature of 260°C to 270°C. A soldering iron with a fine tip and a low-temperature solder paste can help prevent overheating and ensure reliable solder joints.

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DFLZ8V2-TP Overview

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