The recommended PCB footprint for the DG2517EDQ-T1-GE3 is a standard QFN16 package with a 3x3 mm body size and 0.5 mm pitch. The datasheet provides a recommended land pattern and soldering guidelines.
To ensure reliable operation in high-temperature environments, follow the recommended operating temperature range of -40°C to 125°C, and ensure proper thermal management, such as using a heat sink or thermal pad, to keep the junction temperature below 150°C.
The DG2517EDQ-T1-GE3 has an ESD protection level of ±2 kV human body model (HBM) and ±1 kV charged device model (CDM), which provides robust protection against electrostatic discharge.
Yes, the DG2517EDQ-T1-GE3 is suitable for high-frequency applications up to 1 GHz. However, it's essential to follow proper PCB design and layout guidelines to minimize signal loss and ensure signal integrity.
The recommended storage condition for the DG2517EDQ-T1-GE3 is in a dry, cool place with a temperature range of 5°C to 30°C and relative humidity below 60%. Avoid exposing the device to direct sunlight, moisture, or extreme temperatures.
Trust Checks
This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
DG2517EDQ-T1-GE3 Overview
Use the download button to access the DG2517EDQ-T1-GE3 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like DG251,
or try a keyword search, such as Multiplexers or Switches
