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DG2525DN-T1-GE4 - Vishay

Description: VISHAY - DG2525DN-T1-GE4 - ANALOGUE SWITCH, 4 CH, SPDT, MINIQFN-16

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Symbol
DG2525DN-T1-GE4 - Vishay - PCB symbol
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PCB Footprints
DG2525DN-T1-GE4 - Vishay PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - Thin miniQFN16
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3D Models
DG2525DN-T1-GE4 - Vishay - 3D model - Quad Flat No-Lead - Thin miniQFN16
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DG2525DN-T1-GE4 Details

  • Manufacturer Part Number:

    DG2525DN-T1-GE4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-16

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Date Of Intro:

    2016-08-16

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    8.68

  • Analog IC - Other Type:

    SPDT

  • JESD-30 Code:

    R-PQCC-N16

  • Length:

    2.6 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    55 dB

  • On-state Resistance Match-Nom:

    0.05 Ω

  • On-state Resistance-Max (Ron):

    0.6 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC16,.07X.1,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.6 mm

  • Signal Current-Max:

    0.3 A

  • Supply Current-Max (Isup):

    0.06 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    1.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    3000 ns

  • Switch-on Time-Max:

    70000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Terminal Finish:

    PALLADIUM GOLD OVER NICKEL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.8 mm

DG2525DN-T1-GE4 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DG2525DN-T1-GE4 is a 2.5mm x 2.5mm pad with a 1.5mm x 1.5mm thermal pad. It's essential to follow the recommended footprint to ensure proper thermal performance and to prevent overheating.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C. Apply a small amount of solder paste to the PCB pads, and then place the DG2525DN-T1-GE4 on the PCB. Use a reflow oven or a hot air gun to solder the device. Avoid overheating or applying excessive force, which can damage the device.
  • The DG2525DN-T1-GE4 has an operating temperature range of -40°C to 125°C. However, it's essential to note that the device's performance and reliability may degrade if operated at extreme temperatures for extended periods.
  • The DG2525DN-T1-GE4 is not hermetically sealed, so it's not recommended for use in high-humidity environments. If you must use the device in a humid environment, ensure proper conformal coating and follow the manufacturer's guidelines for moisture protection.
  • Handle the DG2525DN-T1-GE4 by the edges to prevent damage to the pins or the device's surface. Store the devices in their original packaging or in a dry, ESD-protected environment. Avoid exposing the devices to direct sunlight, moisture, or extreme temperatures.

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DG2525DN-T1-GE4 Overview

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