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DG2730DN-T1-GE4 - Vishay

Description: Analog Switch Single DPDT 10-Pin Mini-QFN T/R

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PCB Footprints
DG2730DN-T1-GE4 - Vishay PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - MINI QFN-10L 1
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3D Models
DG2730DN-T1-GE4 - Vishay  - 3D model - Quad Flat No-Lead - MINI QFN-10L 1
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DG2730DN-T1-GE4 Details

  • Manufacturer Part Number:

    DG2730DN-T1-GE4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-10

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.95

  • Analog IC - Other Type:

    DPDT

  • JESD-30 Code:

    R-XQCC-N10

  • JESD-609 Code:

    e4

  • Length:

    1.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Channels:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Off-state Isolation-Nom:

    30 dB

  • On-state Resistance Match-Nom:

    0.8 Ω

  • On-state Resistance-Max (Ron):

    8 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    VQCCN

  • Package Equivalence Code:

    LCC10,.06X.07,16

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.6 mm

  • Supply Voltage-Max (Vsup):

    4.3 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    25 ns

  • Switch-on Time-Max:

    30 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    1.4 mm

DG2730DN-T1-GE4 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DG2730DN-T1-GE4 is a 4-pad QFN package with a 2x2 mm body size and 0.5 mm pitch. A recommended land pattern is available in the Vishay Intertechnologies application note AN81142.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking and airflow. The device is rated for operation up to 125°C, but derating may be necessary for extended reliability.
  • The recommended drive strength for the DG2730DN-T1-GE4 is a 10-20 mA output current, depending on the specific application requirements. It is essential to ensure that the drive strength is sufficient to maintain signal integrity and prevent signal degradation.
  • The DG2730DN-T1-GE4 has built-in ESD protection, but it is still recommended to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding straps, and wrist straps to prevent damage to the device.
  • The recommended power sequencing for the DG2730DN-T1-GE4 is to power up the VCC supply before the VEE supply. This ensures proper device operation and prevents potential latch-up or damage to the device.

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