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DG401DY-T1-E3 - Vishay

Description: Analog Switch ICs DUAL SPDT SWITCH

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DG401DY-T1-E3 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - 16 LEAD SOIC-
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DG401DY-T1-E3 - Vishay  - 3D model - Small Outline Packages - 16 LEAD SOIC-
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DG401DY-T1-E3 Details

  • Manufacturer Part Number:

    DG401DY-T1-E3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.38

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    72 dB

  • On-state Resistance Match-Nom:

    3 Ω

  • On-state Resistance-Max (Ron):

    45 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    100 ns

  • Switch-on Time-Max:

    150 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

DG401DY-T1-E3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DG401DY-T1-E3 is a standard SOT23-3 package with a minimum pad size of 0.8mm x 0.8mm and a maximum pad size of 1.2mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape.
  • To ensure proper soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux to the pads. Use a solder with a melting point of 217°C to 220°C, and avoid applying excessive heat or pressure to the component.
  • The DG401DY-T1-E3 has an operating temperature range of -40°C to 125°C, but it's recommended to operate within -20°C to 85°C for optimal performance and reliability.
  • Yes, the DG401DY-T1-E3 is suitable for high-reliability and automotive applications, as it meets the requirements of AEC-Q101 and is manufactured in accordance with IATF 16949:2016 standards.
  • To prevent electrostatic discharge (ESD) damage, handle the DG401DY-T1-E3 with an ESD wrist strap or mat, and ensure that the workspace and equipment are ESD-protected. Avoid touching the component pins or handling the component in a way that could generate static electricity.

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DG401DY-T1-E3 Overview

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For a full list of alternate parts for DG401DY-T1-E3, check out Findchips.com