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DG408DVZ - Renesas Electronics

Description: The DG408 Single 8-Channel, and DG409 Differential 4-Channel monolithic CMOS analog multiplexers are drop-in replacements for the popular DG508A and DG509A series devices. They each include an array of eight analog switches, a TTL/CMOS compatible digital decode circuit for channel selection, a voltage reference for logic thresholds and an ENABLE input for device selection when several multiplexers are present. The DG408 and DG409 feature lower signal ON resistance (

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DG408DVZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M16.173 16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
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DG408DVZ - Renesas Electronics  - 3D model - Small Outline Packages - M16.173 16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
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DG408DVZ Details

  • Manufacturer Part Number:

    DG408DVZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.173

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    5 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -20 V

  • Neg Supply Voltage-Min (Vsup):

    -5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NO

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    75 dB

  • On-state Resistance-Max (Ron):

    125 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Signal Current-Max:

    0.03 A

  • Supply Current-Max (Isup):

    2 mA

  • Supply Voltage-Max (Vsup):

    20 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    150 ns

  • Switch-on Time-Max:

    225 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

DG408DVZ Frequently Asked Questions (FAQs)

  • A good PCB layout for the DG408DVZ should include a solid ground plane, separate analog and digital grounds, and keep the analog and digital signal traces separate. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to place the device close to the power supply to minimize noise.
  • To ensure proper power-up and initialization, make sure to follow the recommended power-up sequence: VCC should be powered up first, followed by VDD. The device should be powered up slowly (dv/dt < 10V/μs) to prevent latch-up. Also, ensure that the input signals are within the recommended voltage range during power-up.
  • Although the datasheet specifies the recommended analog input voltage range, it's essential to note that the maximum allowable voltage on the analog input pins is VCC + 0.3V. Exceeding this voltage may cause damage to the device.
  • To ensure reliable operation, it's crucial to manage the DG408DVZ's thermal performance. Use a heat sink or thermal pad to dissipate heat, and ensure good airflow around the device. Also, consider using a thermally conductive material for the PCB to help dissipate heat.
  • To prevent electrostatic discharge (ESD) damage, use ESD protection devices such as TVS diodes or ESD protection arrays on the input pins. Also, ensure that the PCB is designed with ESD protection in mind, including the use of ESD-resistant materials and proper handling procedures during assembly and testing.

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DG408DVZ Overview

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