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DG444BDN-T1-E4 - Vishay

Description: 4 Circuit IC Switch 1:1 80Ohm 16-QFN (4x4)

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PCB Footprints
DG444BDN-T1-E4 - Vishay PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN 4x4-16L_2024
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3D Models
DG444BDN-T1-E4 - Vishay  - 3D model - Quad Flat No-Lead - QFN 4x4-16L_2024
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DG444BDN-T1-E4 Details

  • Manufacturer Part Number:

    DG444BDN-T1-E4

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.48

  • Analog IC - Other Type:

    SPST

  • Moisture Sensitivity Level:

    1

  • Qualification Status:

    Not Qualified

  • Terminal Finish:

    Palladium/Gold (Pd/Au) - with Nickel (Ni) barrier

DG444BDN-T1-E4 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DG444BDN-T1-E4 is a standard SOIC-8 package with a minimum pad size of 1.5mm x 1.5mm and a maximum pad size of 2.5mm x 2.5mm, with a 0.5mm spacing between pads.
  • To ensure reliable operation of the DG444BDN-T1-E4 in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and ensuring good airflow around the device.
  • The maximum allowable power dissipation for the DG444BDN-T1-E4 is 1.4W, and it is recommended to derate the power dissipation by 2.5mW/°C above 25°C to ensure reliable operation.
  • Yes, the DG444BDN-T1-E4 can be used in high-frequency applications up to 100MHz, but it is recommended to follow proper PCB layout and design practices to minimize parasitic inductance and capacitance.
  • Yes, the DG444BDN-T1-E4 is compatible with lead-free soldering processes, and it is recommended to follow the manufacturer's recommended soldering profile to ensure reliable assembly.

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DG444BDN-T1-E4 Overview

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