DG506BEN-T1-GE3 footprint, schematic symbol and 3D model by Vishay

Symbol

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PCB Footprints

DG506BEN-T1-GE3 - Vishay PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - PLCC: 28-LEAD

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3D Models

DG506BEN-T1-GE3 - Vishay - 3D model - Plastic Leaded Chip Carrier - PLCC: 28-LEAD

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Datasheet Download Datasheet
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Part Number DG506BEN-T1-GE3
Manufacturer Vishay
Pin Count 28
Part Category Integrated Circuit
Package Category Plastic Leaded Chip Carrier
Footprint Name Plastic Leaded Chip Carrier - PLCC: 28-LEAD
Released Date Dec 22, 2019
Last Modified Date Jul 26, 2024 7:39 AM UTC
Pinout / Pin List Click Here (Member Only)

DG506BEN-T1-GE3 Details

Manufacturer Part Number:
DG506BEN-T1-GE3
Rohs Code:
Yes
Part Life Cycle Code:
Obsolete
Package Description:
HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, LCC-28
HTS Code:
8542.39.00.60
Manufacturer:
Vishay Intertechnologies
YTEOL:
0
Analog IC - Other Type:
SINGLE-ENDED MULTIPLEXER
JESD-30 Code:
S-PQCC-J28
Length:
11.5062 mm
Neg Supply Voltage-Max (Vsup):
-20 V
Neg Supply Voltage-Min (Vsup):
-5 V
Neg Supply Voltage-Nom (Vsup):
-15 V
Number of Channels:
16
Number of Functions:
1
Number of Terminals:
28
Off-state Isolation-Nom:
85 dB
On-state Resistance Match-Nom:
10 Ω
On-state Resistance-Max (Ron):
300 Ω
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
QCCJ
Package Equivalence Code:
LDCC28,.5SQ
Package Shape:
SQUARE
Package Style:
CHIP CARRIER
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
4.57 mm
Signal Current-Max:
0.03 A
Supply Current-Max (Isup):
0.1 mA
Supply Voltage-Max (Vsup):
20 V
Supply Voltage-Min (Vsup):
5 V
Supply Voltage-Nom (Vsup):
15 V
Surface Mount:
YES
Switch-off Time-Max:
220 ns
Switch-on Time-Max:
310 ns
Switching:
BREAK-BEFORE-MAKE
Technology:
CMOS
Temperature Grade:
AUTOMOTIVE
Terminal Form:
J BEND
Terminal Pitch:
1.27 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
40
Width:
11.5062 mm

DG506BEN-T1-GE3 Frequently Asked Questions (FAQs)

The recommended PCB footprint for the DG506BEN-T1-GE3 can be found in the Vishay Intertechnologies' application note AN42171, which provides detailed information on land pattern and soldering recommendations.
To ensure reliable operation in high-temperature environments, it is recommended to follow the derating guidelines provided in the datasheet, and to consider using a heat sink or thermal management system to keep the junction temperature below the maximum rated value.
The maximum allowable voltage stress on the DG506BEN-T1-GE3 during switching is dependent on the specific application and operating conditions. As a general guideline, it is recommended to limit the voltage stress to 10% above the maximum rated voltage to ensure reliable operation.
Yes, the DG506BEN-T1-GE3 is suitable for high-frequency switching applications up to 100 kHz. However, it is recommended to consult with Vishay Intertechnologies' application engineers to ensure that the device meets the specific requirements of the application.
The recommended ESD protection for the DG506BEN-T1-GE3 is to follow the guidelines provided in the datasheet, which includes using ESD-sensitive handling and storage procedures, and incorporating ESD protection devices in the circuit design.

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DG506BEN-T1-GE3 - Vishay

DG506BEN-T1-GE3 Details

DG506BEN-T1-GE3 Frequently Asked Questions (FAQs)

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