DG507BEW-T1-GE3 footprint, schematic symbol and 3D model by Vishay

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Part Number DG507BEW-T1-GE3
Manufacturer Vishay
Pin Count 28
Part Category Integrated Circuit
Package Category Small Outline Packages
Footprint Name Small Outline Packages - DG507BEW-T1-GE3
Released Date Apr 11, 2019
Last Modified Date Mar 7, 2023 4:10 PM UTC
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DG507BEW-T1-GE3 Details

Manufacturer Part Number:
DG507BEW-T1-GE3
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
HALOGEN FREE AND ROHS COMPLIANT, SOIC-28
HTS Code:
8542.39.00.60
Manufacturer:
Vishay Intertechnologies
YTEOL:
6.58
Analog IC - Other Type:
DIFFERENTIAL MULTIPLEXER
JESD-30 Code:
R-PDSO-G28
Length:
17.9 mm
Neg Supply Voltage-Max (Vsup):
-20 V
Neg Supply Voltage-Min (Vsup):
-5 V
Neg Supply Voltage-Nom (Vsup):
-15 V
Number of Channels:
8
Number of Functions:
1
Number of Terminals:
28
Off-state Isolation-Nom:
84 dB
On-state Resistance Match-Nom:
10 Ω
On-state Resistance-Max (Ron):
300 Ω
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Package Body Material:
PLASTIC/EPOXY
Package Code:
SOP
Package Equivalence Code:
SOP28,.4
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
2.54 mm
Signal Current-Max:
0.03 A
Supply Current-Max (Isup):
0.1 mA
Supply Voltage-Max (Vsup):
20 V
Supply Voltage-Min (Vsup):
5 V
Supply Voltage-Nom (Vsup):
15 V
Surface Mount:
YES
Switch-off Time-Max:
220 ns
Switch-on Time-Max:
310 ns
Switching:
BREAK-BEFORE-MAKE
Technology:
CMOS
Temperature Grade:
AUTOMOTIVE
Terminal Form:
GULL WING
Terminal Pitch:
1.27 mm
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
40
Width:
7.5 mm

DG507BEW-T1-GE3 Frequently Asked Questions (FAQs)

The recommended PCB footprint for the DG507BEW-T1-GE3 can be found in the Vishay Intertechnologies' application note AN81142, which provides detailed guidelines for PCB layout and land pattern design.
To ensure reliable soldering, follow the recommended soldering profile and temperature guidelines provided in the Vishay Intertechnologies' application note AN81142. Additionally, use a solder with a melting point below 260°C and avoid excessive soldering temperatures or times.
The maximum operating temperature range for the DG507BEW-T1-GE3 is -40°C to 125°C, as specified in the datasheet. However, it's essential to note that the device's performance and reliability may degrade at extreme temperatures, so it's recommended to operate within the specified temperature range for optimal performance.
The DG507BEW-T1-GE3 is designed to withstand moderate vibration levels, but it's essential to evaluate the device's performance in your specific application. Vishay Intertechnologies recommends following the guidelines in the application note AN81142 for vibration testing and ensuring that the device is properly secured to the PCB to minimize the risk of mechanical stress.
The DG507BEW-T1-GE3 has built-in ESD protection, but it's still essential to follow proper ESD handling and storage procedures to prevent damage. Vishay Intertechnologies recommends following the guidelines in the application note AN81142 for ESD protection and handling.

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DG507BEW-T1-GE3 - Vishay

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