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DG508AAK - Analog Devices

Description: Monolithic CMOS Analog Multiplexers, ±4.5V to ±18V, 10μA, 0.2mA, -55°C to +125°C

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DG508AAK - Analog Devices PCB footprint - Ceramic Dual-In-Line Packages - Ceramic Dual-In-Line Packages - 16 CERDIP
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DG508AAK Details

  • Manufacturer Part Number:

    DG508AAK

  • Brand Name:

    Analog Devices Inc

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    16-CERDIP-300_MIL

  • Package Description:

    CERAMIC, DIP-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    16-CERDIP-300_MIL

  • Country Of Origin:

    Japan, Mainland China, Malaysia, Philippines, Singapore, South Korea, Taiwan, Thailand, USA

  • HTS Code:

    8542.39.00.60

  • Date Of Intro:

    1999-05-28

  • Manufacturer:

    Analog Devices Inc

  • YTEOL:

    9

  • Analog IC - Other Type:

    SINGLE-ENDED MULTIPLEXER

  • JESD-30 Code:

    R-CDIP-T16

  • JESD-609 Code:

    e0

  • Length:

    19.05 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -18 V

  • Neg Supply Voltage-Min (Vsup):

    -4.5 V

  • Neg Supply Voltage-Nom (Vsup):

    -15 V

  • Normal Position:

    NC

  • Number of Channels:

    8

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    68 dB

  • On-state Resistance Match-Nom:

    24 Ω

  • On-state Resistance-Max (Ron):

    400 Ω

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Output:

    COMMON OUTPUT

  • Package Body Material:

    CERAMIC, METAL-SEALED COFIRED

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Signal Current-Max:

    0.02 A

  • Supply Current-Max (Isup):

    0.2 mA

  • Supply Voltage-Max (Vsup):

    18 V

  • Supply Voltage-Min (Vsup):

    4.5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    NO

  • Switch-off Time-Max:

    700 ns

  • Switch-on Time-Max:

    1000 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    CMOS

  • Temperature Grade:

    MILITARY

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Width:

    7.62 mm

DG508AAK Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VDD first, followed by VSS, and then the logic inputs. This ensures proper device operation and prevents latch-up.
  • To handle the high output impedance, use a buffer or a follower stage to reduce the impedance and improve signal integrity. Alternatively, use a pull-down or pull-up resistor to stabilize the output.
  • The maximum operating frequency of the DG508AAK is typically around 100 kHz to 200 kHz, depending on the specific application and output loading. However, it's recommended to consult the datasheet and application notes for specific frequency limitations.
  • Yes, the DG508AAK can be used as a level shifter, but it's essential to ensure that the input and output voltage levels are within the recommended operating range. Additionally, consider the output impedance and loading effects when designing the level-shifting circuit.
  • To minimize power consumption, use a low-power supply voltage, reduce the clock frequency, and minimize the output loading. Additionally, consider using a power-down mode or shutdown pin to reduce power consumption when the device is not in use.

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DG508AAK Overview

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About Analog Devices

Analog Devices Inc. is a global leader in the design and manufacturing of analog, mixed-signal, and digital signal processing integrated circuits and software solutions for the industrial, automotive, healthcare, communications industries. Analog Devices serves a diverse range of markets including industrial, automotive, healthcare, energy, aerospace, defense, and consumer electronics industries. Analog Devices’ product portfolio includes a wide range of ICs, modules, and subsystems.

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