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DG612DY-E3 - Vishay

Description: Vishay DG612DY-E3, Analogue Switch Quad SPST, 5 → 21 V, 16-Pin SOIC

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PCB Footprints
DG612DY-E3 - Vishay PCB footprint - Other - Other - SOIC127P600X175-16N
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DG612DY-E3 Details

  • Manufacturer Part Number:

    DG612DY-E3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, MS-012, SOIC-16

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    VIDEO APPLICATION

  • Analog IC - Other Type:

    SPST

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage-Max (Vsup):

    -10 V

  • Neg Supply Voltage-Nom (Vsup):

    -3 V

  • Normal Position:

    NO

  • Number of Channels:

    1

  • Number of Functions:

    4

  • Number of Terminals:

    16

  • Off-state Isolation-Nom:

    74 dB

  • On-state Resistance Match-Nom:

    2 Ω

  • On-state Resistance-Max (Ron):

    45 Ω

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    SEPARATE OUTPUT

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max (Vsup):

    21 V

  • Supply Voltage-Min (Vsup):

    5 V

  • Supply Voltage-Nom (Vsup):

    15 V

  • Surface Mount:

    YES

  • Switch-off Time-Max:

    35 ns

  • Switch-on Time-Max:

    50 ns

  • Switching:

    BREAK-BEFORE-MAKE

  • Technology:

    NMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

DG612DY-E3 Frequently Asked Questions (FAQs)

  • A good PCB layout for the DG612DY-E3 should ensure that the high-frequency signals are kept away from the low-frequency signals, and that the analog and digital grounds are separated. A 4-layer PCB with a solid ground plane and a separate analog ground plane is recommended. Additionally, the layout should minimize the length of the traces and avoid sharp corners to reduce electromagnetic interference (EMI).
  • The DG612DY-E3 has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to provide adequate heat sinking. A thermal pad or a heat sink with a thermal conductivity of at least 1 W/m-K is recommended. The heat sink should be connected to a solid ground plane to dissipate heat efficiently. Additionally, ensure that the surrounding components do not obstruct airflow or heat dissipation.
  • The DG612DY-E3 is a high-speed analog switch, and proper termination is crucial for optimal performance. For the input, a 50Ω termination resistor is recommended to match the impedance of the signal source. For the output, a 50Ω to 75Ω termination resistor is recommended to match the impedance of the load. Additionally, consider adding a series resistor and capacitor to filter out high-frequency noise and ringing.
  • To ensure the reliability and longevity of the DG612DY-E3 in harsh environments, follow proper handling and storage procedures. Avoid exposing the device to extreme temperatures, humidity, or mechanical stress. Use a conformal coating or potting compound to protect the device from moisture and contaminants. Additionally, consider using a device with a higher temperature rating or a more robust package option, such as the DG612DY-E3V, which is designed for automotive applications.
  • The DG612DY-E3 is a sensitive device and requires proper ESD protection and handling precautions. Use an ESD wrist strap or mat when handling the device, and ensure that the workspace is ESD-safe. Avoid touching the device's pins or exposed metal surfaces, and use a vacuum pickup or tweezers to handle the device. Store the device in an ESD-safe package or bag, and follow proper soldering and desoldering procedures to avoid damaging the device.

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