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DGD2136MS28-13 - Diodes Incorporated

Description: Gate Drivers HV Gate Driver

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DGD2136MS28-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-28 (Type TH)
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DGD2136MS28-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-28 (Type TH)
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DGD2136MS28-13 Details

  • Manufacturer Part Number:

    DGD2136MS28-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP, SOP28,.4

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2019-02-28

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    8

  • High Side Driver:

    YES

  • Interface IC Type:

    HALF BRIDGE BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    18 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP28,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Voltage-Max:

    20 V

  • Supply Voltage-Min:

    10 V

  • Supply Voltage-Nom:

    15 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.46 µs

  • Turn-on Time:

    0.46 µs

  • Width:

    7.5 mm

DGD2136MS28-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for the DGD2136MS28-13 should minimize parasitic inductance and capacitance. Keep the input and output traces short and separate, use a solid ground plane, and avoid vias under the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure reliable operation at high temperatures, make sure to follow the recommended operating conditions, including the maximum junction temperature (Tj) of 150°C. Use a suitable thermal interface material, and consider using a heat sink or a thermally conductive PCB material. Also, ensure good airflow around the device.
  • The maximum safe operating area (SOA) for the DGD2136MS28-13 is not explicitly stated in the datasheet. However, it's essential to ensure that the device operates within the recommended voltage and current limits to prevent damage. Consult with Diodes Incorporated or a qualified engineer for specific guidance on SOA.
  • The DGD2136MS28-13 is a commercial-grade device, and its suitability for high-reliability or automotive applications depends on the specific requirements. Diodes Incorporated may offer automotive-grade or high-reliability versions of this device or similar products. Consult with Diodes Incorporated or a qualified engineer for specific guidance.
  • The DGD2136MS28-13 has an integrated ESD protection circuit, but it's still essential to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, tools, and equipment, and ensure that the device is properly grounded during handling.

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DGD2136MS28-13 Overview

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