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DMC1018UPDWQ-13 - Diodes Incorporated

Description: MOSFET MOSFET BVDSS: 8V-24V PowerDI5060-8/SWP T&R 2.5K

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DMC1018UPDWQ-13 - Diodes Incorporated PCB footprint - Other - Other - PowerDI5060-8/SWP(Type UXD)
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DMC1018UPDWQ-13 - Diodes Incorporated  - 3D model - Other - PowerDI5060-8/SWP(Type UXD)
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DMC1018UPDWQ-13 Details

  • Manufacturer Part Number:

    DMC1018UPDWQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    29 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    12 V

  • Drain Current-Max (ID):

    31.3 A

  • Drain-source On Resistance-Max:

    0.017 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    303 pF

  • JESD-30 Code:

    R-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    25 W

  • Pulsed Drain Current-Max (IDM):

    125 A

  • Reference Standard:

    AEC-Q101; IATF 16949; MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMC1018UPDWQ-13 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve heat dissipation. A minimum of 2oz copper thickness and a thermal relief pattern are recommended for optimal thermal performance.
  • Ensure that the device is operated within the recommended voltage and current ratings, and that the PCB is designed to minimize thermal resistance. Additionally, consider using a thermal interface material to improve heat transfer between the device and the PCB.
  • The DMC1018UPDWQ-13 has built-in ESD protection, but it is still recommended to follow standard ESD handling precautions during assembly and testing. A minimum of 2kV HBM and 100V MM protection is recommended.
  • Yes, the DMC1018UPDWQ-13 is AEC-Q100 qualified and suitable for use in high-reliability and automotive applications. However, additional testing and validation may be required to meet specific industry standards.
  • The recommended soldering conditions are 260°C peak reflow temperature, with a maximum of 3 reflows. A soldering time of 10-30 seconds is recommended, with a maximum of 60 seconds.

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DMC1018UPDWQ-13 Overview

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