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DMC10H172SSD-13 - Diodes Incorporated

Description:  100% Unclamped Inductive Switch (UIS) Test in Production  Low Input Capacitance  Low On-Resistance  Fast Switching Speed  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3)  For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/104/200, PPAP capable, and manufactured in IATF 16949 certified facilities), please contact us or your local Diodes representative. https://www.diodes.com/quality/p

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DMC10H172SSD-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8-2024
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DMC10H172SSD-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8-2024
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DMC10H172SSD-13 Details

  • Manufacturer Part Number:

    DMC10H172SSD-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    20 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    2 A

  • Drain-source On Resistance-Max:

    0.16 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    20 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.5 W

  • Pulsed Drain Current-Max (IDM):

    16 A

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMC10H172SSD-13 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing a thermal pad on the bottom of the device, using a minimum of 2oz copper thickness, and ensuring a clearance of at least 0.5mm around the device. Additionally, using thermal vias and a heat sink can further improve thermal performance.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (up to 150°C) and ensure proper heat sinking and thermal management. Additionally, consider using a thermally conductive material for the PCB and ensuring good airflow around the device.
  • The DMC10H172SSD-13 has an ESD rating of Human Body Model (HBM) ≥ 2kV and Machine Model (MM) ≥ 200V. To prevent ESD damage, handle the device with an anti-static wrist strap or mat, and ensure that the PCB and components are properly grounded during assembly and testing.
  • While the DMC10H172SSD-13 is a high-quality device, it's essential to check the specific requirements of your high-reliability or automotive application. Diodes Incorporated provides additional documentation and support for these applications, including AEC-Q101 qualification and PPAP (Production Part Approval Process) support.
  • The recommended soldering and reflow conditions for the DMC10H172SSD-13 involve using a peak reflow temperature of 260°C (max), a soldering temperature range of 220°C to 240°C, and a soldering time of 3 to 5 seconds (max). Ensure that the PCB and components are properly cleaned and prepared before soldering.

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