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DMC2700UDM-7 - Diodes Incorporated

Description: Diodes Inc DMC2700UDM-7 Dual N/P-channel MOSFET Transistor, 6-Pin SOT-26

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PCB Footprints
DMC2700UDM-7 - Diodes Incorporated PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SOT26_2024-1
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3D Models
DMC2700UDM-7 - Diodes Incorporated  - 3D model - SOT23 (6-Pin) - SOT26_2024-1
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DMC2700UDM-7 Details

  • Manufacturer Part Number:

    DMC2700UDM-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-26, 6 PIN

  • Pin Count:

    6

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    1.34 A

  • Drain-source On Resistance-Max:

    0.4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5.37 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.12 W

  • Pulsed Drain Current-Max (IDM):

    5 A

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMC2700UDM-7 Frequently Asked Questions (FAQs)

  • A good PCB layout for the DMC2700UDM-7 should include a solid ground plane, wide power traces, and a thermal relief pattern under the device to facilitate heat dissipation. A 4-layer PCB with a dedicated thermal layer is recommended.
  • To ensure reliable operation at high temperatures, ensure that the device is properly mounted on a heat sink, and the thermal interface material is applied correctly. Also, follow the recommended derating curves for the device's power dissipation vs. temperature.
  • The DMC2700UDM-7 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • Yes, the DMC2700UDM-7 is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended qualification and testing procedures outlined in the AEC-Q100 standard or other relevant industry standards.
  • The recommended soldering conditions for the DMC2700UDM-7 are a peak temperature of 260°C, with a soldering time of 10-15 seconds. Use a solder with a melting point above 217°C, and ensure that the device is not exposed to excessive thermal stress.

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DMC2700UDM-7 Overview

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