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DMC3025LDV-7 - Diodes Incorporated

Description: MOSFET MOSFET BVDSS 31V-40V

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PCB Footprints
DMC3025LDV-7 - Diodes Incorporated PCB footprint - Other - Other - PowerDI3333-8 (Type UXC)_2021
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3D Models
DMC3025LDV-7 - Diodes Incorporated  - 3D model - Other - PowerDI3333-8 (Type UXC)_2021
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DMC3025LDV-7 Details

  • Manufacturer Part Number:

    DMC3025LDV-7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    9.8 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    15 A

  • Drain-source On Resistance-Max:

    0.035 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    57 pF

  • JESD-30 Code:

    S-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    255

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    1.9 W

  • Pulsed Drain Current-Max (IDM):

    55 A

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMC3025LDV-7 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal relief pattern is recommended to ensure good heat dissipation.
  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Also, consider the power dissipation and thermal resistance of the device when designing the system.
  • A 10uF to 22uF X5R or X7R ceramic capacitor is recommended for input decoupling, placed as close to the device as possible.
  • Yes, the DMC3025LDV-7 is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, additional testing and validation may be required for specific use cases.
  • Check the input voltage, output load, and PCB layout for any issues. Ensure that the device is operated within the recommended specifications and that the input and output capacitors are properly selected and placed.

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DMC3025LDV-7 Overview

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