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DMC4040SSD-13 - Diodes Incorporated

Description: MOSFET MOSFET COMP NPN

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DMC4040SSD-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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DMC4040SSD-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8
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DMC4040SSD-13 Details

  • Manufacturer Part Number:

    DMC4040SSD-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT

  • Pin Count:

    8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    7.5 A

  • Drain-source On Resistance-Max:

    0.04 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    120 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    29 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMC4040SSD-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for the DMC4040SSD-13 should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure good copper pour connectivity to dissipate heat efficiently. Avoid routing high-frequency signals near the device to minimize electromagnetic interference.
  • To ensure reliable operation across the entire operating temperature range (-40°C to 125°C), follow the recommended operating conditions, and consider the device's thermal characteristics. Implement proper thermal management, and ensure the device is not exposed to excessive voltage or current stress.
  • The DMC4040SSD-13 has built-in ESD protection, but it's still essential to follow proper handling and assembly procedures to prevent ESD damage. Use ESD-safe materials, handle the device by the body or pins, and avoid touching the pins or dielectric surfaces.
  • Yes, the DMC4040SSD-13 is suitable for high-reliability and automotive applications. It meets the AEC-Q101 qualification standard, ensuring it can withstand the harsh conditions found in automotive environments. However, ensure you follow the recommended operating conditions and design guidelines for your specific application.
  • Follow standard PCB assembly and soldering practices for the DMC4040SSD-13. Use a soldering iron with a temperature range of 250°C to 260°C, and ensure the soldering time is within 3 seconds. Avoid applying excessive force or bending the pins during assembly.

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DMC4040SSD-13 Overview

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