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DMG4466SSSL-13 - Diodes Incorporated

Description: MOSFET N-Ch MOSFET 30V 60A IDM 1.42W PD

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DMG4466SSSL-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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DMG4466SSSL-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8
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DMG4466SSSL-13 Details

  • Manufacturer Part Number:

    DMG4466SSSL-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT

  • Package Description:

    GREEN, PLASTIC, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    10 A

  • Drain-source On Resistance-Max:

    0.023 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.42 W

  • Pulsed Drain Current-Max (IDM):

    60 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMG4466SSSL-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance would be to have a solid ground plane on the bottom layer, and a thermal relief pattern on the top layer. This helps to dissipate heat efficiently. Additionally, it's recommended to have a minimum of 2oz copper thickness and a thermal via array under the device to improve heat dissipation.
  • To ensure proper biasing, follow the recommended voltage and current ratings specified in the datasheet. For the DMG4466SSSL-13, the recommended operating voltage is 2.5V to 5.5V, and the recommended operating current is 1mA to 100mA. Additionally, ensure that the input and output capacitors are properly selected and placed close to the device to minimize noise and oscillations.
  • The critical timing parameters to consider for the DMG4466SSSL-13 are the input rise and fall times, which should be less than 10ns. Additionally, the device has a propagation delay of 10ns, and a pulse width distortion of 5ns. Ensure that your system design takes these timing parameters into account to ensure proper operation.
  • The DMG4466SSSL-13 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that all equipment is properly grounded. Additionally, consider adding external ESD protection devices, such as TVS diodes, to further protect the device from ESD events.
  • The DMG4466SSSL-13 meets the industry-standard reliability and quality standards, including AEC-Q100 and IEC 60747. It's also RoHS and REACH compliant, and manufactured in accordance with ISO/TS 16949 and ISO 9001 quality management systems.

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DMG4466SSSL-13 Overview

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