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DMG6898LSD-13 - Diodes Incorporated

Description: Diodes Inc DMG6898LSD-13 Dual N-channel MOSFET Transistor, 9.5 A, 20 V, 8-Pin SOIC

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DMG6898LSD-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8(h=1.7)a
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DMG6898LSD-13 - Diodes Incorporated  - 3D model - Small Outline Packages - SO-8(h=1.7)a
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DMG6898LSD-13 Details

  • Manufacturer Part Number:

    DMG6898LSD-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    9.5 A

  • Drain-source On Resistance-Max:

    0.016 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    142 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.28 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMG6898LSD-13 Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, including a heat sink, thermal interface material, and a cooling fan if necessary. Monitor the device's junction temperature and adjust the system accordingly.
  • Handle the device with an anti-static wrist strap or mat. Ensure all equipment and tools are grounded. Avoid touching the device's pins or exposed die. Use an ESD-protected workstation and follow standard ESD handling procedures.
  • Yes, but ensure you follow the recommended operating conditions, and perform thorough testing and validation according to the specific industry standards (e.g., AEC-Q100 for automotive).
  • Use a logic analyzer or oscilloscope to monitor the device's input/output signals. Check for voltage drops, current spikes, or thermal issues. Consult the datasheet and application notes for troubleshooting guidelines.

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DMG6898LSD-13 Overview

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