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DMG6898LSDQ-13 - Diodes Incorporated

Description: MOSFET Dual N-Ch Enh FET 30V 9.8A 20Vdss

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DMG6898LSDQ-13 Details

  • Manufacturer Part Number:

    DMG6898LSDQ-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    9.5 A

  • Drain-source On Resistance-Max:

    0.016 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    142 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.28 W

  • Pulsed Drain Current-Max (IDM):

    30 A

  • Reference Standard:

    AEC-Q101; IATF 16949

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMG6898LSDQ-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMG6898LSDQ-13 is a standard SOD-123 package with a 1.7mm x 1.3mm pad size, and a thermal pad for heat dissipation.
  • To ensure proper thermal management, use a thermal pad or heat sink with a thermal conductivity of at least 1 W/m-K, and ensure a good thermal interface between the device and the heat sink. Also, follow the recommended PCB layout and thermal design guidelines.
  • The maximum allowed voltage for the gate-source voltage (Vgs) is ±20V, but it's recommended to keep it between -5V to +15V for reliable operation.
  • Yes, the DMG6898LSDQ-13 is suitable for high-frequency switching applications up to 100 kHz, but ensure proper PCB layout, decoupling, and gate drive design to minimize switching losses and ringing.
  • Handle the device with an ESD wrist strap or mat, and ensure the PCB design includes ESD protection components, such as TVS diodes or ESD protection arrays, to prevent damage from static electricity.

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DMG6898LSDQ-13 Overview

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