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DML3006LFDS-7 - Diodes Incorporated

Description: Power Switch ICs - Power Distribution Single Channel Smart Load Switch

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PCB Footprints
DML3006LFDS-7 - Diodes Incorporated PCB footprint - Other - Other - V-DFN2020-8 (Type F)
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3D Models
DML3006LFDS-7 - Diodes Incorporated  - 3D model - Other - V-DFN2020-8 (Type F)
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DML3006LFDS-7 Details

  • Manufacturer Part Number:

    DML3006LFDS-7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    DFN-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    7

  • Built-in Protections:

    TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

  • Interface IC Type:

    BUFFER OR INVERTER BASED PERIPHERAL DRIVER

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e4

  • Length:

    2 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current Flow Direction:

    SINK

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.08,20

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.85 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    13.5 V

  • Supply Voltage1-Min:

    0.5 V

  • Supply Voltage1-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    2 mm

DML3006LFDS-7 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DML3006LFDS-7 is a 2.5mm x 1.3mm pad with a 0.5mm radius corner, and a 0.3mm x 0.3mm thermal pad in the center.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the risk of overheating the component.
  • The maximum operating temperature range for the DML3006LFDS-7 is -40°C to 125°C. However, it's recommended to operate the device within a temperature range of -20°C to 85°C for optimal performance.
  • Yes, the DML3006LFDS-7 is suitable for high-reliability applications. It's built with a robust design and undergoes rigorous testing to ensure its performance and reliability in demanding environments.
  • Store the DML3006LFDS-7 in its original packaging or an equivalent ESD-protective package. Avoid exposing the device to moisture, extreme temperatures, or physical stress during storage and shipping.

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DML3006LFDS-7 Overview

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