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DMN2027USS-13 - Diodes Incorporated

Description: Trans MOSFET N-CH 20V 10.5A 8-Pin SO T/R

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DMN2027USS-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
DMN2027USS-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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3D Models
DMN2027USS-13 - Diodes Incorporated - 3D model - Small Outline Packages - SO-8
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DMN2027USS-13 Details

  • Manufacturer Part Number:

    DMN2027USS-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT

  • Package Description:

    GREEN, PLASTIC, SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    7.3 A

  • Drain-source On Resistance-Max:

    0.02 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.81 W

  • Pulsed Drain Current-Max (IDM):

    45 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN2027USS-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMN2027USS-13 is a standard SOT23 package with a 1.5mm x 1.5mm pad size, with a 0.5mm spacing between pads.
  • To ensure proper biasing, connect the gate to a voltage source through a 1kΩ to 10kΩ resistor, and connect the source to ground through a 100Ω to 1kΩ resistor. Adjust the resistor values based on the specific application requirements.
  • The maximum safe operating area (SOA) for the DMN2027USS-13 is typically defined by the maximum voltage and current ratings. Ensure that the device operates within the recommended voltage range (up to 20V) and current range (up to 2A) to prevent damage or degradation.
  • To manage thermal performance, ensure good thermal conductivity between the device and the PCB by using thermal vias or a thermal pad. Keep the device away from heat sources and ensure good airflow around the device. Consider using a heat sink if the device is expected to operate at high temperatures or high currents.
  • The DMN2027USS-13 has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. Use ESD-safe materials, grounding straps, and wrist straps to prevent static damage.

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DMN2027USS-13 Overview

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