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DMN2028USS-13 - Diodes Incorporated

Description: Diodes Inc DMN2028USS-13 N-channel MOSFET Transistor, 9.8 A, 20 V, 8-Pin SOIC

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DMN2028USS-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
DMN2028USS-13 - Diodes Incorporated PCB footprint - Small Outline Packages - Small Outline Packages - SO-8
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3D Models
DMN2028USS-13 - Diodes Incorporated - 3D model - Small Outline Packages - SO-8
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DMN2028USS-13 Details

  • Manufacturer Part Number:

    DMN2028USS-13

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT

  • Package Description:

    SOP-8

  • Pin Count:

    8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    7.3 A

  • Drain-source On Resistance-Max:

    0.02 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    158 pF

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.56 W

  • Pulsed Drain Current-Max (IDM):

    45 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN2028USS-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMN2028USS-13 is a standard SOT23 package with a 1.3mm x 1.3mm body size. A minimum pad size of 0.6mm x 0.6mm is recommended for reliable soldering.
  • To ensure reliable operation in high-temperature environments, it is recommended to derate the maximum junction temperature (Tj) by 1°C for every 1W of power dissipation above 25°C. Additionally, ensure good thermal design and heat sinking to minimize thermal resistance.
  • The maximum safe operating area (SOA) for the DMN2028USS-13 is defined by the maximum voltage and current ratings. Ensure that the device operates within the recommended voltage range (30V) and current range (2A) to prevent damage or degradation.
  • To prevent electrostatic discharge (ESD) damage, handle the DMN2028USS-13 with ESD-protective equipment and follow proper handling procedures. Ensure that the device is stored in an ESD-protected environment and that all personnel handling the device are grounded.
  • The recommended soldering conditions for the DMN2028USS-13 are: peak temperature 260°C, time above 217°C 30s, and time above 183°C 90s. Ensure that the soldering process is within these parameters to prevent damage to the device.

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DMN2028USS-13 Overview

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