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DMN3008SFGQ-13 - Diodes Incorporated

Description: Trans MOSFET N-CH 30V 17.6A Automotive 8-Pin PowerDI EP T/R

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DMN3008SFGQ-13 - Diodes Incorporated PCB footprint - Other - Other - PowerDI3333-8_24
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DMN3008SFGQ-13 - Diodes Incorporated  - 3D model - Other - PowerDI3333-8_24
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DMN3008SFGQ-13 Details

  • Manufacturer Part Number:

    DMN3008SFGQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    24 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    101 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    17.6 A

  • Drain-source On Resistance-Max:

    0.0055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    459 pF

  • JESD-30 Code:

    S-PDSO-N5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.1 W

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN3008SFGQ-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMN3008SFGQ-13 is a 3x3mm QFN package with a 0.5mm pitch. The datasheet provides a recommended land pattern and soldering guidelines.
  • To ensure proper soldering, follow the recommended soldering temperature profile and use a solder with a melting point between 220°C to 240°C. Also, ensure the PCB is clean and free of oxidation.
  • The DMN3008SFGQ-13 has an operating temperature range of -55°C to 150°C. However, the maximum junction temperature (TJ) should not exceed 150°C.
  • Yes, the DMN3008SFGQ-13 is AEC-Q101 qualified, making it suitable for automotive and high-reliability applications. However, it's essential to follow the recommended operating conditions and design guidelines to ensure reliability.
  • The DMN3008SFGQ-13 has an ESD rating of 2kV human body model (HBM) and 150V machine model (MM). To prevent ESD damage, handle the device with an ESD wrist strap or mat, and ensure the PCB is properly grounded.

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DMN3008SFGQ-13 Overview

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