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DMN3009SFG-7 - Diodes Incorporated

Description: MOSFETs 30V N-Ch Enh FET 20Vgs Low Rdson

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DMN3009SFG-7 - Diodes Incorporated PCB footprint - Other - Other - PowerDI3333-8_24
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DMN3009SFG-7 - Diodes Incorporated  - 3D model - Other - PowerDI3333-8_24
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DMN3009SFG-7 Details

  • Manufacturer Part Number:

    DMN3009SFG-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    55 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    16 A

  • Drain-source On Resistance-Max:

    0.0055 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    248 pF

  • JESD-30 Code:

    S-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    2.1 W

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Reference Standard:

    MIL-STD-202

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMN3009SFG-7 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMN3009SFG-7 is a standard SOT23 package with a 1.5mm x 1.5mm pad size, with a 0.5mm spacing between pads.
  • To ensure proper biasing, connect the gate to a voltage source through a resistor (e.g., 1kΩ) and connect the source to ground through a resistor (e.g., 1kΩ). The drain should be connected to a load or a voltage source.
  • The DMN3009SFG-7 has an operating temperature range of -55°C to 150°C, but it's recommended to operate within -40°C to 125°C for optimal performance and reliability.
  • The DMN3009SFG-7 is designed as a switch, but it can also be used as a linear amplifier. However, its performance may not be optimal in linear mode, and it's recommended to use a dedicated linear amplifier device for such applications.
  • To protect the DMN3009SFG-7 from ESD, handle the device with an anti-static wrist strap or mat, and ensure the PCB has proper ESD protection circuits, such as TVS diodes or ESD protection arrays.

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DMN3009SFG-7 Overview

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