DMN3025LFG-7 footprint, schematic symbol and 3D model by Diodes Incorporated

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PCB Footprints

DMN3025LFG-7 - Diodes Incorporated PCB footprint - Other - Other - PowerDI3333-8_24

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3D Models

DMN3025LFG-7 - Diodes Incorporated - 3D model - Other - PowerDI3333-8_24

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Datasheet Download Datasheet
Stock & Prices Price & Stock for DMN3025LFG-7
Part Number DMN3025LFG-7
Manufacturer Diodes Incorporated
Pin Count 9
Part Category MOSFET (N-Channel)
Package Category Other
Footprint Name Other - PowerDI3333-8_24
Released Date Oct 13, 2022
Last Modified Date Aug 6, 2026 4:07 PM UTC
Pinout / Pin List Click Here (Member Only)

DMN3025LFG-7 Details

Manufacturer Part Number:
DMN3025LFG-7
Pbfree Code:
Yes
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
GREEN, PLASTIC, POWERDI3333-8, 8 PIN
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
12 Weeks
Manufacturer:
Diodes Incorporated
YTEOL:
5
Additional Feature:
HIGH RELIABILITY
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
30 V
Drain Current-Max (ID):
7.5 A
Drain-source On Resistance-Max:
0.018 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code:
S-PDSO-N5
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
5
Operating Mode:
ENHANCEMENT MODE
Package Body Material:
PLASTIC/EPOXY
Package Shape:
SQUARE
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Pulsed Drain Current-Max (IDM):
60 A
Reference Standard:
AEC-Q101
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
NO LEAD
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

DMN3025LFG-7 Frequently Asked Questions (FAQs)

The recommended PCB footprint for the DMN3025LFG-7 is a 2.5mm x 2.5mm pad with a 1.5mm x 1.5mm thermal pad in the center, and a 0.5mm keep-out area around the device.
To ensure reliable operation in high-temperature environments, it's essential to provide adequate heat sinking, such as a thermal pad or heat sink, and to follow the recommended PCB layout and thermal management guidelines.
The maximum allowed voltage on the gate pin of the DMN3025LFG-7 is 12V, but it's recommended to keep it below 10V to ensure reliable operation and prevent damage to the device.
Yes, the DMN3025LFG-7 can be used in switching applications, but it's essential to ensure that the device is properly driven and that the switching frequency is within the recommended range to prevent overheating and ensure reliable operation.
To calculate the power dissipation of the DMN3025LFG-7, you need to consider the voltage drop across the device, the current flowing through it, and the thermal resistance of the package and PCB. You can use the equations provided in the datasheet or consult with a thermal management expert.

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DMN3025LFG-7 Overview

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DMN3025LFG-7 - Diodes Incorporated

DMN3025LFG-7 Details

DMN3025LFG-7 Frequently Asked Questions (FAQs)

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