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DMNH6021SPD-13 - Diodes Incorporated

Description: MOSFETs MOSFET BVDSS: 41V-60V

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PCB Footprints
DMNH6021SPD-13 - Diodes Incorporated PCB footprint - Other - Other - PowerDI5060-8 (Type C)_2022
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3D Models
DMNH6021SPD-13 - Diodes Incorporated  - 3D model - Other - PowerDI5060-8 (Type C)_2022
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DMNH6021SPD-13 Details

  • Manufacturer Part Number:

    DMNH6021SPD-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    64 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    8.2 A

  • Drain-source On Resistance-Max:

    0.025 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMNH6021SPD-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for the DMNH6021SPD-13 should prioritize thermal dissipation. Place the device near a thermal pad or a heat sink, and ensure that the PCB has sufficient copper area to dissipate heat. A 2-ounce copper layer is recommended. Additionally, keep the component placement and routing symmetrical to minimize thermal gradients.
  • To ensure reliable operation in high-temperature environments, follow the recommended operating conditions and derating guidelines in the datasheet. Additionally, consider using a heat sink or thermal interface material to improve heat dissipation. It's also essential to ensure good airflow around the device and to avoid thermal hotspots.
  • The DMNH6021SPD-13 has built-in ESD protection, but it's still essential to follow proper handling and storage precautions to prevent damage. Use an anti-static wrist strap or mat when handling the device, and store it in an anti-static bag or container. Avoid touching the device's pins or exposed pads, and use a soldering iron with an anti-static tip.
  • The DMNH6021SPD-13 is a commercial-grade device, but it can be used in high-reliability or automotive applications with proper qualification and testing. Diodes Incorporated provides a range of automotive-grade devices, so it's essential to verify the device's suitability for your specific application. Consult with Diodes Incorporated or a qualified engineer to ensure the device meets the required standards and regulations.
  • To troubleshoot common issues like overheating or malfunction, start by verifying the device's operating conditions, including voltage, current, and temperature. Check for proper PCB layout, component placement, and thermal management. Use a thermal camera or thermometer to identify hotspots, and ensure that the device is properly soldered and connected. Consult the datasheet and application notes for guidance on troubleshooting and debugging.

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DMNH6021SPD-13 Overview

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