Part Image

DMP10H400SE-13 - Diodes Incorporated

Description: Trans MOSFET P-CH 100V 2.3A 4-Pin(3+Tab) SOT-223 T/R

Download DMP10H400SE-13 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
DMP10H400SE-13 - Diodes Incorporated PCB footprint - SOT223 (3-Pin) - SOT223 (3-Pin) - SOT-223--
click to zoom
3D Models
DMP10H400SE-13 - Diodes Incorporated  - 3D model - SOT223 (3-Pin) - SOT-223--
click to zoom

DMP10H400SE-13 Details

  • Manufacturer Part Number:

    DMP10H400SE-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-223, 4 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5.6

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    2.3 A

  • Drain-source On Resistance-Max:

    0.3 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    28 pF

  • JESD-30 Code:

    R-PDSO-G4

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    4

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    13.7 W

  • Pulsed Drain Current-Max (IDM):

    10 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMP10H400SE-13 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the DMP10H400SE-13 is a standard SOT23 package with a 1.3mm x 1.3mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the gate to a voltage source through a 1kΩ to 10kΩ resistor, and the source to ground through a 100Ω to 1kΩ resistor. This will provide a stable voltage reference and minimize oscillations.
  • The maximum safe operating area (SOA) for the DMP10H400SE-13 is defined by the voltage and current ratings. Do not exceed 400V drain-source voltage, 10A continuous drain current, and 20A peak drain current to ensure reliable operation.
  • To protect the DMP10H400SE-13 from ESD, handle the device with an anti-static wrist strap or mat, and ensure the PCB has ESD protection diodes or resistors on the input and output pins.
  • The thermal resistance (RθJA) of the DMP10H400SE-13 is approximately 125°C/W. This value is critical for thermal design and heat sink selection to ensure reliable operation.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

DMP10H400SE-13 Overview

Use the download button to access the DMP10H400SE-13 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like DMP10, or try a keyword search, such as Power Field-Effect Transistors

Parts related to DMP10H400SE-13

Showing 0 results