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DMP2008UFG-7 - Diodes Incorporated

Description: Diodes Inc DMP2008UFG-7 P-channel MOSFET Transistor, 11 A, -20 V, 8-Pin POWERDI3333

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DMP2008UFG-7 - Diodes Incorporated - PCB symbol
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PCB Footprints
DMP2008UFG-7 - Diodes Incorporated PCB footprint - Other - Other - PowerDI3333-8_24
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DMP2008UFG-7 - Diodes Incorporated - 3D model - Other - PowerDI3333-8_24
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DMP2008UFG-7 Details

  • Manufacturer Part Number:

    DMP2008UFG-7

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    113 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    14 A

  • Drain-source On Resistance-Max:

    0.008 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-PDSO-N5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    41 W

  • Pulsed Drain Current-Max (IDM):

    80 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMP2008UFG-7 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the package to improve thermal performance. A minimum of 2oz copper thickness and a thermal relief pattern are recommended to ensure good heat dissipation.
  • The device requires a stable input voltage and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to achieve this.
  • Handle the device in an ESD-controlled environment, use ESD-protective packaging, and ground yourself before handling the device to prevent ESD damage.
  • The device is rated for operation up to 150°C, but derating is required for temperatures above 125°C. Ensure proper thermal management and follow the recommended operating conditions.
  • Use a multimeter to measure voltage and current, and an oscilloscope to analyze waveforms. Check for proper biasing, thermal management, and PCB layout. Consult the datasheet and application notes for troubleshooting guidelines.

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DMP2008UFG-7 Overview

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