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DMP2022LSSQ-13 - Diodes Incorporated

Description: P-Channel 20 V 9.3A (Ta) 1.6W (Ta) Surface Mount 8-SO 2.5V, 10V -55°C ~ 155°C 60.2 nC @ 10 V

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DMP2022LSSQ-13 - Diodes Incorporated - PCB symbol
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PCB Footprints
DMP2022LSSQ-13 - Diodes Incorporated PCB footprint - Other - Other - SO-8_2025-1.1
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3D Models
DMP2022LSSQ-13 - Diodes Incorporated - 3D model - Other - SO-8_2025-1.1
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DMP2022LSSQ-13 Details

  • Manufacturer Part Number:

    DMP2022LSSQ-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    HIGH RELIABILITY

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    9.3 A

  • Drain-source On Resistance-Max:

    0.013 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    35 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMP2022LSSQ-13 Frequently Asked Questions (FAQs)

  • Diodes Incorporated recommends a PCB layout with a thermal pad connected to a large copper area on the bottom layer, and multiple vias to dissipate heat efficiently.
  • The DMP2022LSSQ-13 requires a bias voltage of 2.5V to 5.5V, and a bias current of 1mA to 10mA. Ensure the bias circuit is designed to provide a stable voltage and current within these ranges.
  • The maximum power dissipation for the DMP2022LSSQ-13 is 1.4W at a junction temperature of 150°C. Ensure the device is properly heat-sinked and the PCB is designed to dissipate heat efficiently.
  • Yes, the DMP2022LSSQ-13 is suitable for high-frequency switching applications up to 100MHz. However, ensure the device is properly biased and the PCB is designed to minimize parasitic inductance and capacitance.
  • Diodes Incorporated recommends using ESD protection devices, such as TVS diodes or ESD arrays, to protect the DMP2022LSSQ-13 from electrostatic discharge. Additionally, follow proper handling and storage procedures to prevent ESD damage.

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DMP2022LSSQ-13 Overview

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