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DMP3011SFVW-13 - Diodes Incorporated

Description: MOSFETs MOSFET BVDSS: 25V~30V PowerDI3333-8 T&R 3K

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DMP3011SFVW-13 - Diodes Incorporated PCB footprint - Other - Other - PowerDI3333-8 (SWP) (Type UX)
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DMP3011SFVW-13 - Diodes Incorporated  - 3D model - Other - PowerDI3333-8 (SWP) (Type UX)
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DMP3011SFVW-13 Details

  • Manufacturer Part Number:

    DMP3011SFVW-13

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Avalanche Energy Rating (Eas):

    104 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    50 A

  • Drain-source On Resistance-Max:

    0.01 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    296 pF

  • JESD-30 Code:

    S-PDSO-F8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    2.25 W

  • Pulsed Drain Current-Max (IDM):

    176 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

DMP3011SFVW-13 Frequently Asked Questions (FAQs)

  • A good PCB layout for the DMP3011SFVW-13 should minimize parasitic inductance and capacitance. Keep the drain and source pins as close as possible to the PCB ground plane, and use a solid ground plane to reduce noise and EMI. Additionally, keep the input and output traces short and away from each other to minimize cross-talk.
  • To ensure proper biasing, follow the recommended biasing circuit in the datasheet. Typically, this involves connecting the gate to a voltage source through a resistor, and the source to ground through another resistor. The gate voltage should be set to the recommended value (usually around 4-5V) to achieve the desired threshold voltage.
  • The DMP3011SFVW-13 has an operating temperature range of -55°C to 150°C. However, it's recommended to operate the device within a temperature range of -40°C to 125°C for optimal performance and reliability.
  • To protect the DMP3011SFVW-13 from ESD, handle the device by the body or pins, and avoid touching the die. Use an ESD wrist strap or mat, and ensure the workspace is ESD-safe. During assembly, use ESD-safe packaging and handling procedures.
  • Store the DMP3011SFVW-13 in a dry, cool place, away from direct sunlight and moisture. The recommended storage temperature range is -40°C to 30°C, and the relative humidity should be below 60%. Use anti-static packaging and follow proper handling procedures to prevent ESD damage.

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